Monday, September 29, 2014

Top 5 Semiconductor Companies To Invest In 2014

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The grades of six semiconductor stocks are better this week, according to the Portfolio Grader database. Every one of these stocks has an “A” (“strong buy”) or “B” overall (“buy”) rating.

10 Best International Stocks To Invest In 2015: NVIDIA Corporation(NVDA)

NVIDIA Corporation provides visual computing, high performance computing, and mobile computing solutions that generate interactive graphics on various devices ranging from tablets and smart phones to notebooks and workstations. It operates in three segments: Graphic Processing Unit (GPU), Professional Solutions Business (PSB), and Consumer Products Business (CPB). The GPU segment offers GeForce discrete and chipset products, which support desktop and notebook personal computers plus memory products. The PSB segment provides its Quadro professional workstation products and other professional graphics products, including its NVIDIA Tesla high-performance computing products used in the manufacturing, entertainment, medical, science, and aerospace industries. The CPB segment offers Tegra mobile products, which support tablets, smartphones, personal media players, Internet television, automotive navigation, and other similar devices. This segment also licenses video game consol es and other digital consumer electronics devices. The company sells its products to original equipment manufacturers, original design manufacturers, add-in-card manufacturers, consumer electronics companies, and system builders worldwide that utilize its processors as a core component of their entertainment, business, and professional solutions. NVIDIA Corporation was founded in 1993 and is headquartered in Santa Clara, California.

Advisors' Opinion:
  • [By Rustic Nomad]

    Broadcom (BRCM) and NVIDIA (NVDA) are two chipmakers making solid moves. The two companies are seeing strong growth in their businesses. As a result, investors should definitely take a closer look at them.

  • [By Monica Gerson]

    Analysts at Evercore Partners upgraded NVIDIA (NASDAQ: NVDA) from ��nderweight��to ��qual-weight.��The target price for NVIDIA is set to $16.

  • [By Ali Berri]

    NVIDIA (NASDAQ: NVDA) shares were also up, gaining 7.62 percent to $18.79 after the company posted higher Q2 earnings and issued a strong revenue forecast for the current quarter.

Top 5 Semiconductor Companies To Invest In 2014: Advanced Semiconductor Engineering Inc (ASX)

Advanced Semiconductor Engineering, Inc. is principally engaged in the manufacture, assembly, processing, testing and distribution of integrated circuits (ICs). The Company provides semiconductor packaging and testing services, including plastic leaded chip carriers (PLCCs), quad flat packages (QFPs) and flip chip packaging technology, among others, which are applied in the manufacture of household electrical appliances, communication devices, automobile components, personal computers, set top boxes, servers, memory integrated circuits (ICs), mobile phones, digital cameras, game consoles, projectors, high definition (HD) televisions, wireless communication network products and power management ICs, among others. The Company operates its businesses primarily in Taiwan, Europe and the Americas. In August 2010, the Company acquired a 100% interest in EEMS Test Singapore.

The Company is focused on packaging and testing logic semiconductors. The Company offers its customers turnkey services, which consist of packaging, testing and direct shipment of semiconductors to end users designated by its customers. The Company�� global base of over 200 customers includes semiconductor companies across a range of end use applications, including Altera Corporation, ATI Technologies, Inc., Broadcom Corporation, Cambridge Silicon Radio Limited and Microsoft Corporation. During the year ended December 31, 2008, the Company�� packaging revenues accounted for 77.7% of its net revenues and its testing revenues accounted for 20.1% of its net revenues.

Packaging Services

The Company offers a range of package types to meet the requirements of its customers, with a focus on packaging solutions. Within its portfolio of package types, the Company focuses on the packaging of semiconductors. These include advanced leadframe-based package types, such as quad flat package, thin quad flat package, bump chip carrier and quad flat no-lead package, and package types based on substrates, such a! s flip-chip ball grid array (BGA) and other BGA types, as well as other packages, such as wafer-bumping products. Leadframe-based packages are packaged by connecting the die, using wire bonders, to the leadframe with gold wire. The Company�� leadframe-based packages include quad flat package (QFP)/ thin quad flat package (TQFP), quad flat no-lead package (QFN)/microchip carrier (MCC), advanced quad flat no-lead package (AQFN), bump chip carrier (BCC), small outline plastic package (SOP)/thin small outline plastic package (TSOP), small outline plastic j-bend package (SOJ), plastic leaded chip carrier (PLCC) and plastic dual in-line package (PDIP). Substrate-based packages employ the BGA design, which utilizes a substrate rather than a leadframe. It also assembles system-in-a-package products, which involve the integration of more than one chip into the same package. The Company�� substrate-based packages include Plastic BGA, Cavity Down BGA, Stacked-Die BGA, Flip-Chip BGA and land grid array (LGA).

The Company�� wafer-level packaging products include wafer level chip scale package (aCSP) and advanced wafer level package (aWLP). The Company offers module assembly services, which combine one or more packaged semiconductors with other components in an integrated module to enable functionality, typically using surface mount technology (SMT) machines and other machinery and equipment for system-level assembly. End use applications for modules include cellular phones, personal digital assistant (PDAs), wireless local area network (LAN) applications, bluetooth applications, camera modules, automotive applications and toys.

The Company provides module assembly services primarily at its facilities in Korea for radio frequency and power amplifier modules used in wireless communications and automotive applications. Interconnect materials connect the input/output on the semiconductor dies to the printed circuit board. Interconnect materials include substrate, which is a multi-layer m! iniature ! printed circuit board. The Company produces substrates for use in its packaging operations.

Testing Services

The Company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, final testing of logic/mixed-signal/radio frequency (RF) and memory semiconductors and other test-related services. The Company provides front-end engineering testing services, including customized software development, electrical design validation, and reliability and failure analysis. The Company provides final testing services for a variety of memory products, such as static random access memory (SRAM), dynamic random access memory (DRAM), single-bit erasable programmable read-only memory semiconductors and flash memory semiconductors.

The Company provides a range of additional test-related services, including burn-in testing, module sip testing, dry pack, tape and reel, and electric interface board and mechanical test tool design. The Company offers drop shipment services for shipment of semiconductors directly to end users designated by its customers.

Advisors' Opinion:
  • [By Namitha Jagadeesh]

    The FTSE 100 Index (UKX) fell 1.31 points, less than 0.1 percent, to 6,679.77 at 10:12 a.m. in London, trimming an earlier decline of as much as 0.6 percent. The gauge has climbed 13 percent this year as central banks maintained stimulus measures to support the global economy. The broader FTSE All-Share Index (ASX) was also little changed today, while Ireland�� ISEQ Index retreated 0.3 percent.

Top 5 Semiconductor Companies To Invest In 2014: Malaysian Pacific Industries Bhd (MPI)

Malaysian Pacific Industries Berhad (MPI) is an investment holding company. The principal activities of MPI, through its subsidiaries are manufacturing, assembling, testing and sale of integrated circuits, semiconductor devices, electronic components and lead frames to customers globally. The Company�� operating geographical segments include Asia, The United States of America, and Europe. The Company's subsidiaries include Carsem (M) Sdn Bhd, Recams Sdn Bhd, Carsem Holdings Limited, Carsem Semiconductor (Suzhou) Co., Ltd, Dynacraft Industries Sdn Bhd, Carter Realty Sdn Bhd, Carter Realty Sdn Bhd and Carsem Holdings (HK) Limited. Advisors' Opinion:
  • [By Sofia Horta e Costa]

    Michael Page International Plc (MPI) increased 1.1 percent to 490.2 pence after Goldman Sachs Group Inc. upgraded the stock to buy from neutral, saying the recruitment firm will benefit from a pick-up in the European economy.

Top 5 Semiconductor Companies To Invest In 2014: AT & S Austria Technologie & Systemtechnik AG (AUS)

AT & S Austria Technologie & Systemtechnik AG (AT&S) is an Austria-based company that is principally engaged in the production of printed circuit boards. The Company is divided into three core business units: Mobile Devices; Automotive, and Industrial. The Company�� product assortment ranges from single- and double-sided printed circuit boards to multilayer printed circuit boards. They are used as electromechanical linking elements, mainly in the telecommunication sector, automobile industry and medical technology applications, as well as defense and aerospace. AT&S operates production sites in Austria, India, China and Korea. It also maintains international sales offices, based in Austria, Ireland, Germany, the Czech Republic, France, Hungary and Belgium. As of March 31, 2011, the Company operated through its subsidiaries in India, Germany, Austria, China, Hong Kong, Japan, South Korea, Taiwan and the United States. Advisors' Opinion:
  • [By Triska Hamid]

    Professors at the American University of Sharjah (AUS) are also looking at dental care with braces imbedded with a chip that monitor the movement of the fixtures and will communicate with the dentist's office if any of them are separated from the teeth.

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